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AMD Chipsets Launched: Fiorano and Kroner Platforms to Follow

September 21, 2009

The Channel Register is reporting on the launch of AMD’s motherboard chipsets which will drive new socket-F based Fiorano and Kroner platforms as well as the socket G34 and C32 based Maranello and San Marino platforms. The Register also points out that no tier one PC maker is announcing socket-F solutions based on the new chipsets today. However, motherboard and “barebones” maker Supermicro is also announcing new A+ server, blade and workstation variants using the new AMD SR5690 and SP5100 chipsets, enabling:

  • GPU-optimized designs: Support up to four double-width GPUs along with two CPUs and up to 3 additional high-performance add-on cards.
  • Up to 10 quad-processor (MP) or dual-processor (DP) Blades in a 7U enclosure: Industry-leading density and power efficiency with up to 240 processor cores and 640GB memory per 7U enclosure.
  • 6Gb/s SAS 2.0 designs: Four-socket and two-socket server and workstation solutions with double the data throughput of previous generation storage architectures.
  • Universal I/O designs: Provide flexible I/O customization and investment protection.
  • QDR InfiniBand support option: Integrated QDR IB switch and UIO add-on card solution for maximum I/O performance.
  • High memory capacity: 16 DIMM models with high capacity memory support to dramatically improve memory and virtualization performance.
  • PCI-E 2.0 Slots plus Dual HT Links (HT3) to CPUs: Enhance motherboard I/O bandwidth and performance. Optimal for QDR IB card support.
  • Onboard IPMI 2.0 support: Reduces remote management costs.

Eco-Systems based on Supermicro’s venerable AS2021M – based on the NVidia nForce Pro 3600 chipset – can now be augmented with the Supermicro AS2021A variant based on AMD’s SR5690/SP5100 pairing. Besides offering HT3.0 and on-board Winbond WPCM450 KVM/IP BMC module, the new iteration includes support for the SR5690’s IOMMU function (experimentally supported by VMware), 16 DDR2 800/667/533 DIMMs, and four PCI-E 2.0 slots – all in the same, familiar 2U chassis with eight 3.5″ hot-swap bays.

AMD’s John Fruehe outlines AMD’s market approach for the new chipsets in his “AMD at Work” blog today. Based on the same basic logic/silicon, the SR5690, SR5670 and SR5650 all deliver PCI-E 2.0 and HT3.0 but at differing levels of power consumption and PCI Express lanes to their respective platforms. Paired with appropriate “power and speed” Opteron variant, these platforms offer system designers, virtualization architects and HPC vendors greater control over price-performance and power-performance constraints that drive their respective environments.

AMD chose the occasion of the Embedded Systems Conference in Boston to announce its new chipset to the world. Citing performance-per-watt advantages that could enhance embedded systems in the telecom, storage and security markets, AMD’s press release highlighted three separate vendors with products ready to ship based on the new AMD chipsets.

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